Qualcomm has announced smart audio platform for manufacturers that want to develop a smart home speaker. The company says its new AllPlay smart audio platform chipsets. Reduce development time for manufacturers as they have the necessary equipment and tools.
The chipmaker introduced the new audio platform at its Voice and Music Developers conference in Shenzhen. Qualcomm at the conference also talked about few of the trends in audio industry including streaming of music, removal of headphone jack, and emergence of smart assistants and speakers. Qualcomm’s AllPlay multi-room audio streaming technology will allow users to configure multiple speakers to play the same or different songs in each room of the home. From streaming services, local playlists on their devices, or DLNA media servers. Moreover, the open nature of the AllPlay ecosystem will enable users to link together speakers from different brands. Such as Panasonic, Hitachi, House of Marley, Magnat etc, in their home using this platform.
Under the company’s new Qualcomm smart audio platform, it will be offering the APQ8009 and APQ8017 chips. AllPlay multi-room audio streaming technology, and support for major voice ecosystems in a single solution. The far-field voice capture will allow the smart speaker to pick up the user’s voice even from afar. The Qualcomm APQ8009 and APQ8017 chips also beamforming and echo cancellation; barge-in and voice capture in noisy environments; software supporting virtual assistants, and support for hands-free voice calls over both VoIP and HFP. Qualcomm has confirmed that the new smart audio platform will receive support for Amazon Alexa Voice Service and Google Assistant. As well as Android Things and Google Cast for Audio.
Flash programmable Audio chipsets
Additionally, the company at the event announced a new addition to its audio system-on-chip (SoCs) platform, namely CSRA68100. Designed for premium wireless speakers and headphones. The company says it is “designed to provide OEMs with significantly more programming resources and freedom. And to develop use cases with unique and differentiating features.” A highly integrated platform, it also supports several connectivity, system processing, audio processing and power management resources.
Qualcomm also announced QCC3XXX series of entry-level, flash-programmable audio chipsets. These are aimed at developing entry-level products at competitive price points for Bluetooth headsets and speakers. There’s also the new WHS9420 and WHS9410 single chip USB audio SoC platforms, designed specifically for USB-C connected audio devices. With smartphone brands doing away with the 3.5mm headphone jack. Platform is aimed at users who want to continue to use wired headsets and speakers on their phones by means of transfer of audio via the USB Type-C port.
At the event, Qualcomm also revealed its next generation Qualcomm DDFA audio amplifier. The technology for audio devices like wireless speakers, sound bars, networked audio, and headphone amplifiers. The next-generation DDFA tech will be available on Qualcomm’s CSRA6620 SoC. Also include a DDFA controller with eight channel inputs, two channel outputs, microcontroller and configurable audio processor. Qualcomm says the chip will “help OEMs to integrate best-in-class amplifier performance in a lower complexity, more cost effective way than was previously possible.”